The symposia for the conference will be finalised after abstract submission, however programming will feature all aspects pertaining to the modelling of solidification phenomena, including but not limited to: solidification process technologies (such as continuous and semi-continuous casting, shape casting, additive manufacturing, and welding); coupled multi-physics simulations; defect formation; fluid flow & heat transfer; micro & macro structure formation; numerical methods; data-driven optimisation & machine learning; as well as related experimentation, especially in-situ observation of solidification.
In addition, MCWASPXVII will feature two special symposia, which you can request inclusion into during abstract submission.
Memorial Symposium – Prof. Christoph Beckerman
It was with great sorrow we convey the sad news that our esteemed colleague and friend, Prof. Christoff Beckermann, passed away in April 2025. He was an invaluable member of our community, conducting groundbreaking research in many fields of numerical modelling of heat transfer and solidification, pioneering phase field calculations and defect prediction. Christoph was a regular contributor to the MCWASP conference series and was conference Chair alongside Brian Thomas for the 8th incarnation of MCWASP held in San Diego, 1998.
To honour Christoph’s memory and celebrate his remarkable achievements and contributions to this field, we will be holding a memorial symposium in his honour. We welcome submissions to this session from authors who personally knew Christoph or were inspired by his work.
Industrial Symposium – Industrial Perspectives, Challenges and Opportunities
New for MCWASP, we are dedicating a symposium for speakers from industry to facilitate wider discussions around how our community can support industry and tackle emerging challenges. We anticipate this symposium will highlight Case Studies where numerical modelling has both benefitted industry and future challenges facing industry that modelling can address. We hope this symposium will create opportunities for academic and industry attendees to collaborate in solving these challenges.